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XC7K480T-2FFG676I

Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:

General Description Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include: • Spartan®-7 Family: Optimized for low cost, lowest power, and high I/O performance. Available in low-cost, very small form-factor packaging for smallest PCB footprint. • Artix®-7 Family: Optimized for low power applications requiring serial transceivers and high DSP and logic throughput. Provides the lowest total bill of materials cost for high-throughput, cost-sensitive applications. • Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs. • Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology. Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs. Summary of 7 Series FPGA Features • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory. • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering. • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s. • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces. • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors. • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering. • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter. • Quickly deploy embedded processing with MicroBlaze™ processor. • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs. • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction. • Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option. • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power. 19 7 Series FPGAs Data Sheet: Overview DS180 (v2.6.1) September 8, 2020 Product Specification Table 1: 7 Series Families Comparison Max. Capability Spartan-7 Artix-7 Kintex-7 Virtex-7 Logic Cells 102K 215K 478K 1,955K Block RAM(1) 4.2 Mb 13 Mb 34 Mb 68 Mb DSP Slices 160 740 1,920 3,600 DSP Performance(2) 176 GMAC/s 929 GMAC/s 2,845 GMAC/s 5,335 GMAC/s MicroBlaze CPU(3) 260 DMIPs 303 DMIPs 438 DMIPs 441 DMIPs Transceivers – 16 32 96 Transceiver Speed – 6.6 Gb/s 12.5 Gb/s 28.05 Gb/s Serial Bandwidth – 211 Gb/s 800 Gb/s 2,784 Gb/s PCIe Interface – x4 Gen2 x8 Gen2 x8 Gen3 Memory Interface 800 Mb/s 1,066 Mb/s 1,866 Mb/s 1,866 Mb/s I/O Pins 400 500 500 1,200 I/O Voltage 1.2V–3.3V 1.2V–3.3V 1.2V–3.3V 1.2V–3.3V Package Options Low-Cost, Wire-Bond Low-Cost, Wire-Bond, Bare-Die Flip-Chip Bare-Die Flip-Chip and HighPerformance Flip-Chip Highest Performanc

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