产品特性
- 制造商产品型号：XCZU6CG-1FFVB1156E
- 制造商：Xilinx Inc.（赛灵思半导体）
- 功能描述：IC SOC CORTEX-A53 1156FCBGA
- 产品系列：嵌入式 - 片上系统（SoC）
- 包装：散装
- 系列：Zynq? UltraScale+? MPSoC CG
- 零件状态：有源
- 架构：MCU，FPGA
- 核心处理器：带 CoreSight? 的双核 ARM? Cortex?-A53 MPCore?，带 CoreSight? 的双核 ARM?Cortex?-R5
- 闪存大小：-
- RAM大小：256KB
- 外设：DMA，WDT
- 连接能力：CANbus，EBI/EMI，以太网，I2C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
- 速度：500MHz，1.2GHz
- 主要属性：Zynq?UltraScale+? FPGA，469K+ 逻辑单元
- 工作温度：0°C ~ 100°C（TJ）
- 产品封装：1156-BBGA，FCBGA
Summary
The Xilinx® Zynq® UltraScale+™ MPSoCs
are available in -3, -2, -1 speed
grades, with -3E devices having
the highest performance. The -2LE and -1LI devices can operate at a V
CCINT
voltage at 0.85V or 0.72V and
are screened for lower maximum stat
ic power. When operated at V
CCINT
= 0.85V, using -2LE and -1LI
devices, the speed specification for the L devices is the same as the -2I or -1I speed grades. When
operated at V
CCINT
= 0.72V, the -2LE and -1LI performance and static and dynamic power is reduced.
DC and AC characteristics are specified in extended
(E), industrial (I), and expanded (Q) temperature
ranges. Except the operating temperature range or unl
ess otherwise noted, all the DC and AC electrical
parameters are the same for a particular speed grade
(that is, the timing characteristics of a -1 speed
grade extended device are the same as for a -1 speed grade industrial device). However, only selected
speed grades and/or devices are av
ailable in each temperature range.
All supply voltage and junction temp
erature specifications are representative of worst-case conditions.
The parameters included are common to po
pular designs and typical applications.
This data sheet, part of an overall set of document
ation on the Zynq UltraScale+ MPSoC
Summary
The Xilinx® Zynq® UltraScale+™ MPSoCs
are available in -3, -2, -1 speed
grades, with -3E devices having
the highest performance. The -2LE and -1LI devices can operate at a V
CCINT
voltage at 0.85V or 0.72V and
are screened for lower maximum stat
ic power. When operated at V
CCINT
=The Zynq® UltraScale+™ MPSoC family is based on the Xilinx® UltraScale™ MPSoC architecture. This
family of products integrates a feature-rich 64-bit quad-core or dual-core Arm® Cortex™-A53 and
dual-core Arm Cortex-R5 based processing system (PS) and Xilinx programmable logic (PL) UltraScale
architecture in a single device. Also included are on-chip memory, multiport external memory interfaces,
and a rich set of peripheral connectivity interfaces.
Processing System (PS)
Arm Cortex-A53 Based Application
Processing Unit (APU)
• Quad-core or dual-core
• CPU frequency: Up to 1.5GHz
• Extendable cache coherency
• Armv8-A Architecture
o 64-bit or 32-bit operating modes
o TrustZone security
o A64 instruction set in 64-bit mode,
A32/T32 instruction set in 32-bit mode
• NEON Advanced SIMD media-processing engine
• Single/double precision Floating Point Unit (FPU)
• CoreSight™ and Embedded Trace Macrocell (ETM)
• Accelerator Coherency Port (ACP)
• AXI Coherency Extension (ACE)
• Power island gating for each processor core
• Timer and Interrupts
o Arm Generic timers support
o Two system level triple-timer counters
o One watchdog timer
o One global system timer
• Caches
o 32KB Level 1, 2-way set-associative
instruction cache with parity (independent for
each CPU)
o 32KB Level 1, 4-way set-associative data
cache with ECC (independent for each CPU)
o 1MB 16-way set-associative Level 2 cache
with ECC (shared between the CPUs)
Dual-core Arm Cortex-R5 Based
Real-Time Processing Unit (RPU)
• CPU frequency: Up to 600MHz
• Armv7-R Architecture
o A32/T32 instruction set
• Single/double precision Floating Point Unit (FPU)
• CoreSight™ and Embedded Trace Macrocell
(ETM)
• Lock-step or independent operation
• Timer and Interrupts:
o One watchdog timer
o Two triple-timer counters
• Caches and Tightly Coupled Memories (TCMs)
o 32KB Level 1, 4-way set-associative
instruction and data cache with ECC
(independent for each CPU)
o 128KB TCM with ECC (independent for each
CPU) that can be combined to become 256KB
in lockstep mode
On-Chip Memory
• 256KB on-chip RAM (OCM) in PS with ECC
• Up to 36Mb on-chip RAM (UltraRAM) with ECC in
PL
• Up to 35Mb on-chip RAM (block RAM) with ECC
in PL
• Up to 11Mb on-chip RAM (distributed RAM
主芯片和MCU
模拟和接口芯片
MEMS传感器
网通WIFI芯片