主芯片和MCU

XCKU115-2FLVA1517I

Kintex® UltraScale™   20nm   FPGA

The Xilinx® Kintex® UltraScale™ FPGAs are available in -3, -2, -1, and -1L speed grades, with -3 having the highest performance. The -1L devices can operate at either of two VCCINT voltages, 0.95V and 0.90V and are screened for lower maximum static power. When operated at VCCINT = 0.95V, the speed specification of a -1L device is the same as the -1 speed grade. When operated at VCCINT = 0.90V, the -1L performance and static and dynamic power is reduced. DC and AC characteristics are specified in commercial, extended, industrial, and military temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade industrial device are the same as for a -1 speed grade commercial device). However, only selected speed grades and/or devices are available in each temperature range. All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters included are common to popular designs and typical applications. This data sheet, part of an overall set of documentation on the UltraScale architecture-based devices, is available on the Xilinx website at www.xilinx.com/documentation. DC Characteristics Kintex UltraScale FPGAs Data Sheet: DC and AC Switching Characteristics DS892 (v1.19) September 22, 2020 Product Specification Table 1: Absolute Maximum Ratings(1) Symbol Description Min Max Units FPGA Logic VCCINT Internal supply voltage –0.500 1.100 V VCCINT_IO(2) Internal supply voltage for the I/O banks –0.500 1.100 V VCCAUX Auxiliary supply voltage –0.500 2.000 V VCCBRAM Supply voltage for the block RAM memories –0.500 1.100 V VCCO Output drivers supply voltage for HR I/O banks –0.500 3.400 V Output drivers supply voltage for HP I/O banks –0.500 2.000 V VCCAUX_IO(3) Auxiliary supply voltage for the I/O banks –0.500 2.000 V VREF Input reference voltage –0.500 2.000 V VIN(4)(5)(6) I/O input voltage for HR I/O banks –0.400 VCCO + 0.550 V I/O input voltage for HP I/O banks –0.550 VCCO + 0.550 V I/O input voltage (when VCCO = 3.3V) for VREF and differential I/O standards except TMDS_33(7) –0.400 2.625 V Send Feedback Kintex UltraScale FPGAs Data Sheet: DC and AC Switching Characteristics DS892 (v1.19) September 22, 2020 www.xilinx.com Product Specification 2 VBATT Key memory battery backup supply –0.500 2.000 V IDC Available output current at the pad –20 20 mA IRMS Available RMS output current at the pad –20 20 mA GTH and GTY Transceivers VMGTAVCC Analog supply voltage for the GTH and GTY transmitter and receiver circuits –0.500 1.100 V VMGTAVTT Analog supply voltage for the GTH and GTY transmitter and receiver termination circuits –0.500 1.320 V VMGTVCCAUX Auxiliary analog Quad PLL (QPLL) voltage supply for the GTH and GTY transceivers –0.500 1.935 V VMGTREFCLK GTH and GTY transceiver reference clocks absolute input voltage –0.500 1.320 V VMGTAVTTRCAL Analog supply voltage for the resistor calibration circuit of the GTH and GTY transceiver columns –0.500 1.320 V VIN Receiver (RXP/RXN) and Transmitter (TXP/TXN) absolute input voltage –0.500 1.260 V IDCIN-FLOAT DC input current for receiver input pins DC coupled RX termination = floating – 0(8) mA IDCIN-MGTAVTT DC input current for receiver input pins DC coupled RX termination = VMGTAVTT – 10 mA IDCIN-GND DC input current for receiver input pins DC coupled RX termination = GND – 10 mA IDCIN-PROG DC input current for receiver input pins DC coupled RX termination = Programmable – N/A(8) mA IDCOUT-FLOAT DC output current for transmitter pins DC coupled RX termination = floating – 0(8) mA IDCOUT-MGTAVTT DC output current for transmitter pins DC coupled RX termination = VMGTAVTT – 6 mA System Monitor VCCADC System Monitor supply relative to GNDADC –0.500 2.000 V VREFP System Monitor reference input relative to GNDADC –0.500 2.000 V Temperature TSTG Storage temperature (ambient) –65 150 °C TSOL Maximum soldering temperature for Pb-free component bodies(9) – 260 °C Maximum soldering temperature for Pb/Sn component bodies(9) – 220 °C

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